Plasmas for micro- and nanotechnologies

Plasma surface treatment: industrial and fundamental challenges

Plasma surface treatment is a key technology in the microelectronics industry, as well as in the fabrication of micro- and nano-scale components. Most of the critical steps involved in the production of integrated circuits rely on plasma processes, whether for etching or thin-film deposition (semiconductors, metals, insulators, resists).

Plasma-enhanced deposition is widely used for the passivation of electronic components and the creation of active layers, particularly in the flat-panel display and photovoltaic industries. Plasma etching enables the fine structuring of materials (silicon, oxides, nitrides, polymers) down to the nanometer scale, an essential step in device miniaturization.

Despite the development of a multi-billion-dollar global industry, many scientific challenges remain. A deeper understanding of the interaction mechanisms between reactive plasmas and materials is becoming crucial to support the introduction of new materials and to ensure ever finer resolutions in manufacturing processes.

Our research approach

• Our group focuses on the physical and chemical foundations of plasma processes. Our work addresses:

  • Radio-frequency plasma physics,

  • The chemistry of reactive species,

  • Plasma–surface interactions at the atomic scale.

• We adopt a multidisciplinary approach:

  • Experimental, through the development of innovative diagnostics;

  • Numerical, using fluid models and atomistic simulations;

  • Theoretical, through the development of analytical models and scaling laws.

Example of an ongoing project

Study of reactive oxygen species (atoms and molecules) in a large-area radio-frequency reactor operating at intermediate pressure (1 to 10 Torr). The objective is to better understand the generation, transport, and reactivity of these species in the context of industrial applications such as etching and surface functionalization.